SUSS (Hughes Microtech), a leading supplier of equipment and process solutions for the German semiconductor industry, recently announced the opening of a new production base in Zhubei, Taiwan. SUSS has invested approximately 15 million euros (approximately NT$533 million) in the new Zhubei plant, mainly for the construction of office space and clean room facilities. The new Zhubei plant has therefore become SUSS's largest overseas infrastructure investment to date.
SUSS stated that the opening of the new base is expected to double SUSS's clean room production capacity in Taiwan to 6,300 square meters. The total indoor area of the entire base is approximately 18,000 square meters, covering production, research and development, technical support, training and administrative functions, providing an advanced working environment for more than 400 Taiwanese employees of SUSS.
Dr. Thomas Rohe, Chief Operating Officer (COO) of SUSS, said that in the past two years, the number of equipment produced by SUSS has reached a record high, and the global production network is also operating at full capacity. The opening of the new Zhubei plant will inject more production capacity, and SUSS has established the same scale and highly flexible production capacity in Germany and Taiwan. It can be flexibly configured according to customer needs to support the production of different solutions.
Dr. Thomas Rohe particularly emphasized the importance of Taiwan to the company. A few years ago, after careful consideration, SUSS decided to establish SUSS's only overseas production base in Taiwan. This not only established an excellent corporate image, but also became an indispensable part of Taiwan's semiconductor industry community.
SUSS CEO Burkhardt Frick said that Taiwan has a unique ecosystem, high-tech talents and supply chains, as well as wafer manufacturers that lead the global market and are responsible for producing most of the world's advanced chips. SUSS is honored to be a part of this ecosystem and work with customers to develop solutions that lead industry innovation.
In response to this industry trend, SUSS established the Advanced Back-end Process Solutions Division. The coating, exposure and wafer bonding solutions of this department contribute two-thirds of the group's sales. Burkhardt Frick took the heterogeneous integration of chip modules as an example and pointed out that this technology transfers more innovation potential to the back-end process of the semiconductor value chain.
SUSS emphasized that due to the rapid growth of business in recent years, the SUSS Taiwan team was originally dispersed across eight locations. After the relocation operation is completed, each unit will be gradually consolidated to the new location in Zhubei. The temporary wafer bonding machines, coating machines and projection scanning exposure machines currently produced by SUSS in Taiwan are all solutions of the Advanced Back-end Processing Division. The first batch of equipment is expected to be delivered to customers in early 2026.
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