Memory manufacturer Micron recently announced that DRAM and NAND Flash departments have made many key progress, especially in the field of high-frequency wide memory (HBM), which not only drives strong industry growth, but also establishes its leading position in the next generation of HBM technology.
Microtron President and Executive Director Sanjay Mehrotra emphasized that it will enhance the following solutions to improve market performance. Micron has confirmed the fastest 11Gbps HBM4 product in the industry, and also announced a cooperation with NTU to jointly manufacture base logic dies for HBM4E memory, laying the foundation for future cutting-edge computing.
Microelectronics confirmed that HBM's market share has grown stably and is expected to achieve the goal of consistent with the overall DRAM market share in the third quarter of 2025. Micron reiterated that its HBM4 12-Hi DRAM solution progress meets expectations and aims to support the accelerated development of customer platforms. Additionally, to meet the market's growing demand for HBM4 bandwidth and foot speed, Micron has produced and shipped the fastest HBM4 solution to date. The product offers foot speeds over 11 Gbps and frequency widths over 2.8 TB/s. Micron believes that this new product will surpass all competitors’ HBM4 products in terms of performance and efficiency, providing industry-leading performance and best-in-class power efficiency.
Mehrotra said that the key differential factors of Micron's HBM4 products include its mature 1-gamma (1γ) DRAM process, innovative and power-efficient HBM4 design, advanced CMOS-based chips developed internally, and advanced packaging innovation technologies. In addition, Micron has expanded its HBM customer base to six. Looking ahead to the next generation of technology HBM4E memory, Micron expects it to be launched in 2027. In the development of HBM4E, Micron's strategic layout is different from that of HBM. Although HBM is entirely based on Micron's internal and advanced CMOS-based grain design, Micron will choose to cooperate with TEE to jointly manufacture base layer logical grains for the HBM4E memory.
Taiwan Electric Cooperation applies HBM4E standard products and customized products. Micron pointed out that for HBM4E, they will provide standard products and allow customers to customize base layer logical chips, and customization needs are highly dependent on tight collaborations with customers. Micron expects that HBM4E products equipped with customized base layer logical crystals will bring higher gross profit margins than standard HBM4E.
In terms of market supply and demand, Micron has made important progress in HBM sales. The company and almost all customers have signed pricing agreements on most HBM3E supplies in 2026. Among them, for HBM4, Micron is currently discussing specifications and quantities with customers. The company expects to complete the agreement in the next few months to sell the remaining total HBM supply for 2026.
In addition to HBM's leadership position, Micron continues to be the leader in other high-performance memory fields. Micron worked closely with NVIDIA (NVIDIA) to be the first to promote the adoption of low-power DDR (LPDRAM) in servers. Micron has been the exclusive supplier of LPDRAM, a data center, since NVIDIA launched its GB product range.
Micro GDDR7 products are also in a favorable position. The memory is designed to provide ultra-high speed performance and optimal power efficiency to meet the needs of a particular AI system in the future. Micron expects that the pace speed of GDDR7's future iteration products will exceed 40 Gbps. Micron originally released the GDDR7 foot speed at 32 Gbps, so over 40 Gbps will increase the mark by about 25%. Currently, NVIDIA is the only GPU manufacturer that utilizes GDDR7 in GPUs.
Finally, Micron has achieved significant achievements in basic production. Its 1γDRAM stage has achieved mature yields within the time of creation, 50% faster than the previous generation. Mehrotra emphasizes that G9 NAND's production has been successfully developed, covering TLC and QLC NAND Flash solutions. In the field of solid-state hard drives (SSDs), Micron is the first to promote PCIe Gen6 SSD to be used in data centers. Looking ahead, Micron will continue to provide more solutions using 16Gb 1γDRAM.
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